Semiconductor Advanced Packaging

18.05.2021

Englisch

9789811613753

Springer Singapore

Nein

John H. Lau

498

Gebundene Ausgabe

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 4½ years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana–Champaign.With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

System-in-Package, Flip Chip Technology, Thermocompression Bonding and Chip-to-Wafer Bonding, Wafer-to-Wafer Bondind and Hybrid Bonding, Fan-in Wafer/Panel-Level Chip-Scale Package, Fan-out Wafer/Panel-Level Packaging, Through-silicon Vias and Redistribution-Layers, 2D, 2.1D, 2.3D, 2.5D, and 3D IC Integration, High Bandwidth Memeory, Heterogenenous Chiplets Integration

TJF - Elektronik TJFD - Elektronische Geräte und Materialien TGP - Fertigungstechnik und Ingenieurwesen

235 mm

15.5 cm