iPhoneAlle anzeigen
iPhone 11iPhone 11 ProiPhone 11 Pro MaxiPhone 12iPhone 12 ProiPhone 12 Pro MaxiPhone 12 miniiPhone 13iPhone 13 ProiPhone 13 Pro MaxiPhone 13 miniiPhone 14iPhone 14 PlusiPhone 14 ProiPhone 14 Pro MaxiPhone 15iPhone 15 PlusiPhone 15 ProiPhone 15 Pro MaxiPhone 16iPhone 16 PlusiPhone 16 ProiPhone 16 Pro MaxiPhone 16eiPhone 8iPhone 8 PlusiPhone SE 2020iPhone SE 2022iPhone XiPhone XRiPhone XSiPhone XS Max
Galaxy A-SerieAlle anzeigen
Galaxy A12Galaxy A13Galaxy A13 5GGalaxy A14Galaxy A15Galaxy A16Galaxy A17 5GGalaxy A20eGalaxy A21Galaxy A22Galaxy A23Galaxy A24Galaxy A25Galaxy A26 5GGalaxy A32Galaxy A33Galaxy A34Galaxy A35Galaxy A36 5GGalaxy A40Galaxy A41Galaxy A42Galaxy A50Galaxy A51Galaxy A52Galaxy A53Galaxy A54Galaxy A55Galaxy A56 5GGalaxy A70Galaxy A71Galaxy A72
Redmi SeriesAlle anzeigen
Redmi 10Redmi 13CRedmi 15 5GRedmi Note 10Redmi Note 10 ProRedmi Note 11Redmi Note 11 ProRedmi Note 11 Pro Plus 5GRedmi Note 11sRedmi Note 12Redmi Note 12 5GRedmi Note 12 ProRedmi Note 12 Pro 5GRedmi Note 12 Pro PlusRedmi Note 13Redmi Note 13 5GRedmi Note 13 ProRedmi Note 13 Pro PlusRedmi Note 14Redmi Note 14 Pro PlusRedmi Note 8Redmi Note 8 ProRedmi Note 9Redmi Note 9 Pro
- Startseite
Bücher Englische Bücher Wissen & Bildung Naturwissenschaft, Medizin, Informatik, Technik Physik & Astronomie Mechanik & Akustik Solution of Crack Problems
Derzeit nicht verfügbar
Handgeprüfte Gebrauchtware
Bis zu 50 % günstiger als neu
Der Umwelt zuliebe
Solution of Crack Problems
D.A. Hills, P.A. Kelly, D.N. Dai, A.M. Korsunsky (Broschiert, Englisch)
★★★★★
☆☆☆☆☆ Keine Bewertungen vorhanden
Optischer Zustand
Beschreibung
This book is concerned with the numerical solution of crack problems. The techniques to be developed are particularly appropriate when cracks are relatively short, and are growing in the neighbourhood of some stress raising feature, causing a relatively steep stress gradient. It is therefore practicable to represent the geometry in an idealised way, so that a precise solution may be obtained. This… contrasts with, say, the finite element method in which the geometry is modelled exactly, but the subsequent solution is approximate, and computationally more taxing. The family of techniques presented in this book, based loosely on the pioneering work of Eshelby in the late 1950's, and developed by Erdogan, Keer, Mura and many others cited in the text, present an attractive alternative. The basic idea is to use the superposition of the stress field present in the unfiawed body, together with an unknown distribution of 'strain nuclei' (in this book, the strain nucleus employed is the dislocation), chosen so that the crack faces become traction-free. The solution used for the stress field for the nucleus is chosen so that other boundary conditions are satisfied. The technique is therefore efficient, and may be used to model the evolution of a developing crack in two or three dimensions. Solution techniques are described in some detail, and the book should be readily accessible to most engineers, whilst preserving the rigour demanded by the researcher who wishes to develop the method itself. Dieses Produkt haben wir gerade leider nicht auf Lager.
Handgeprüfte Gebrauchtware
Bis zu 50 % günstiger als neu
Der Umwelt zuliebe
Technische Daten
Erscheinungsdatum
09.12.2010
Sprache
Englisch
EAN
9789048146512
Herausgeber
Springer Netherland
Serien- oder Bandtitel
Solid Mechanics and Its Applications
Sonderedition
Nein
Autor
D.A. Hills, P.A. Kelly, D.N. Dai, A.M. Korsunsky
Seitenanzahl
308
Auflage
1
Einbandart
Broschiert
Hersteller: Springer, Europaplatz 3, Heidelberg, Deutschland, 69115, ProductSafety@springernature.com, Springer Nature Customer Service Center GmbH
-.-
★★★★★
☆☆☆☆☆ Leider noch keine Bewertungen
Leider noch keine Bewertungen
Sicher bei rebuy kaufen
Schreib die erste Bewertung für dieses Produkt!
Wenn du eine Bewertung für dieses Produkt schreibst, hilfst du allen Kund:innen, die noch überlegen, ob sie das Produkt kaufen wollen. Vielen Dank, dass du mitmachst!
Sicher bei rebuy kaufen