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Bücher Englische Bücher Wissen & Bildung Naturwissenschaft, Medizin, Informatik, Technik Informatik & EDV Hardware VLSI-SOC: From Systems to Chips
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Beschreibung
This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous… conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book. 106,99 €
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Technische Daten
Erscheinungsdatum
19.11.2010
Sprache
Englisch
EAN
9781441941268
Herausgeber
Springer US
Serien- oder Bandtitel
IFIP Advances in Information and Communication Technology
Sonderedition
Nein
Seitenanzahl
314
Einbandart
Broschiert
Buch Untertitel
IFIP TC 10/WG 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-SoC 2003), December 1-3, 2003, Darmstadt, Germany
Schlagwörter
CMOS, OFDM, SystemC, architecture, configuration, optimization, system on chip (SoC), testing
Thema-Inhalt
UK - Computerhardware
TJFC - Schaltkreise und Komponenten (Bauteile)
Höhe
235 mm
Breite
15.5 cm
Transparenz & Sicherheit
Hersteller: Springer, Europaplatz 3, Heidelberg, Deutschland, 69115, ProductSafety@springernature.com, Springer Nature Customer Service Center GmbH
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