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Bücher Wissen & Bildung Englische Bücher Naturwissenschaft, Medizin, Informatik, Technik Informatik & EDV Hardware VLSI-SOC: From Systems to Chips
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VLSI-SOC: From Systems to Chips
(Gebundene Ausgabe, Englisch)
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Beschreibung
This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous… conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book. Dieses Produkt haben wir gerade leider nicht auf Lager.
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Technische Daten
Erscheinungsdatum
17.05.2006
Sprache
Englisch
EAN
9780387334028
Herausgeber
Springer US
Serien- oder Bandtitel
IFIP Advances in Information and Communication Technology
Sonderedition
Nein
Seitenanzahl
314
Auflage
1
Einbandart
Gebundene Ausgabe
Einbandart Details
Laminiert
Transparenz & Sicherheit
Hersteller: Springer Nature B.V., ProductSafety@springernature.com, Springer Nature Customer Service Center GmbH
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